Copper clad aluminum communication equipment substrateis mainly used in network base stations. At present, aluminum-copper plating technology is mainly used at home and abroad. However, aluminum-copper plating process is seriously polluted and production is limited.
Copper clad aluminum plate sheet for communication equipment substrate produced by is suitable for base station construction of 3G 4G 5G network, effectively replacing the traditional aluminum copper plating process. It can greatly improve product performance, reduce processing links, and is environmentally friendly, in line with the national green environmental protection needs.
Features: stable quality, safety and environmental protection, high production efficiency and low comprehensive processing cost.
| Thickness | Width | Temper | Bonding strength | Copper ratio | Tensile strength | Elongation | DC Resistivity |
| 2.0-3.5mm | ≤1000mm | H18 | ≥12N/mm | 10-20% | 160-260MPa | ≤10% | <0.0245Ω.mm2/m |
