1. The use of surface mounts technology (SMT);
2. in the circuit design eucalyptus thermal diffusion in a very effective treatment;
3. Reduce product operating temperature, increase the power density and reliability, extend product life;
The smaller footprint and lower hardware and assembly costs;
5. Replace the fragile ceramic substrates, better mechanical durability.
PCB aluminum plate structure
PCB copper clad aluminum is metal circuit board materials, copper foil, thermal insulation layer and the metal substrate composition, its structure is divided into three layers:
Cireuitl.Layer line layer: the equivalent of the common PCB CCL, line loz copper foil thickness to 10oz.
Dielectric Layer Insulation: insulation layer is a layer of thermal insulation materials with low thermal resistance. Thickness: 0.003 "to 0.006" inch aluminum clad technique is the core count of lies, has received UL certification.
Base Layer grassroots: a metal substrate, usually aluminum or copper may be selected. Aluminum clad and traditional epoxy glass cloth laminated panels.
